Photo radical generator, photo sensitive resin composition and article

ABSTRACT

The invention provides a radical generator, although being a self-cleavage type initiator, which is capable of suppressing volatilization of low molecular weight decomposition materials at the time of light radiation and post-baking, and leaving no low molecular weight decomposition materials in the final product, a photosensitive resin composition and an article using the radical generator. The photoradical generator provided according to the invention contains a compound (a) having one or more self-cleavage type radical-generating parts and one or more ethylenic unsaturated groups in one molecule.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Divisional of U.S. patent application Ser. No.10/946,782, entitled “PHOTO RADICAL GENERATOR PHOTO SENSITIVE RESINCOMPOSITION AND ARTICLE”, filed Sep. 22, 2004 now U.S. Pat. No.7,141,354 which claims priority of Japanese patent application serialnumber 2003-342340, filed Sep. 30, 2003.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a photoradical generator comprising acompound comprising molecular structure having self-cleavage typeradical-generating parts and ethylenic unsaturated groups, aphotosensitive resin composition containing the generator, and anarticle produced from the resin composition.

Particularly, the invention relates firstly to a photoradical generatorwhich itself has a function as a photoradical initiator and a functionas a polymerizable compound and a self-cleavage type high reactionpotential (high sensitivity) as well as fixation capability of thecleavage parts of the photoradical initiator in a matrix and isexcellent in compatibility with monomer components.

Secondarily, the invention relates to a photosensitive resin compositioncontaining the radical generator and being capable of decreasing theodor (outgas) at the time of exposure or post-baking and lesseningvolatile low molecular weight decomposition materials, particularlyodorous components, remaining in a product after curing.

Thirdly, the invention relates to an article of which at least a portionis made of the cured product of the photosensitive resin composition andwhich has high heat resistance and stability so as to be scarcelydeteriorated with heat.

2. Description of the Related Art

Photosensitive resins to be cured or to have solubility by lightirradiation of UV rays or the like are generally classified into twotypes; those having exposed parts with good solubility (positive type)and those having unexposed parts with good solubility (negative type).In the case of the negative type, since the photosensitive resinsthemselves are cured and become insoluble by exposure, thephotosensitive resins themselves often remain on substrates to fromportions of products as functional films.

Although the negative type photosensitive resin has been used for, forexample, paints, printing inks, overcoat layers, adhesives, printingmaster plates or the like, it has been recently used in wideapplications ranging to products such as solder resists for wireprotection in printed wiring boards, layer insulation films and resistsfor forming pixels in color filters, antireflection films, hologram orthe like.

One of generally popular negative type photosensitive resins includes aresin composition containing a compound having one or more ethylenicunsaturated bonds, a photoradical initiator for generating radicals bylight irradiation, and if necessary, a macro molecular compound, aninorganic filler, a pigment or the like for providing developing abilityand softness of coating layer. When light is irradiated to thecomposition, the molecules of the compound having the ethylenicunsaturated bonds are bonded by radical reaction to increase themolecular weight and be cured. At the time of the curing reaction,three-dimensional mesh structure is developed by the crosslinkingreaction, so that the hardness, strength, adhesion property, solventresistance, and heat resistance of the cured product to be obtained areincreased.

Photoradical initiators are broadly classified into self-cleavage type(Type I), and non-self-cleavage type (Type II) (Photocuring technology,p. 39, Technical Information Institute Co., Ltd., 2000). In the case ofthe former, just like a benzoin ether type compound, the bonds at thepositions corresponding to light with specified wavelength are cut byabsorbing the light and radicals are generated at the respective cutpositions at the moment and there radical reaction starts. In the caseof the latter, such a radical initiator has a radical generationmechanism for generating radicals without decomposition at the time ofabsorption of light with the specified wavelength and, for example, inthe case of a hydrogen-drawing type represented by benzophenone, itabsorbs electromagnetic wave with specified wavelength and when elevatedto excited state, it draws hydrogen from hydrogen donors in thesurrounding and at that moment, radicals are generated in both of thedrawing side and the drawn side.

In general, self-cleavage type radical initiators are good in thesensitivity and radical generation efficiency, however generate lowmolecular decomposition materials at the time of light irradiation andsuch low molecular decomposition materials cause odor by volatilizationin the work environments or are condensed again after volatilization toresult in pollution of production apparatus and inferior productproduction, or such low molecular decomposition materials remain inproducts to deteriorate heat resistance and stability of the products orare slowly released from the products.

On the other hand, the hydrogen-drawing type are free from thegeneration or remaining of the low molecular decomposition materialsderived from the initiators, however, they require existence of hydrogendonors in the vicinity of the excited initiators or have relatively lowsensitivity since their radical generation efficiency is determineddepending on the energy barrier height at the time of drawing ofhydrogen.

To say more practically, there may be the following problems of theself-cleavage type initiators to be encountered in the case of varioususes.

Firstly, as an example, use for a solder resist or color resist can beexemplified. The solder resist to be used for surface coverage of aprinted wiring board contains an organic pigment and a filler forproviding heat resistance and flame resistance or the resist for pixelformation for a color filter contains a pigment for color display. Sincethese pigments are components absorbing light, they utilize mainlyself-cleavage type photoradical initiators and are added in largequantities including the amount for vain use in radical reaction of themHere, the portion which is not effectively used in the radical reactionincludes the unreacted initiators not cleaved by radiation and thosewhich become inactive by inhibition from the contact with objects to bereacted because of solid-phase reaction even though they become radicalby cleavage.

Accordingly, the initiators are used in large quantities, so that largequantities of low molecular decomposition materials are generated at thetime of light radiation and odor is emitted. Further, in the curedproducts after exposure, large quantities of residues derived from theinitiators exist and among them, the un-self-cleaved photoradicalinitiators still keep reactivity even after the exposure and thereforedenature the cured products. Also, the un-self-cleaved photoradicalinitiators and inactivated low molecular decomposition materials whichare cleaved but not consumed by the radical reaction are not bonded tothe crosslinking structure of the matrix and exist as independentcomponents in the cured products to deteriorate the physical properties.Therefore, if the residues derived from the initiators are left as theyare, they worsen the light fastness, colorization or discoloration,separation and cracking of the coating layers and lead to deteriorationof the reliability of the final products, for example, interlayerinsulating films for electronic parts, solder resist, resist for pixelformation for color filters.

The self-cleavage type photoradical initiator has a strong sublimationtendency and is decomposed by heat. It can be therefore removed from aproduct by post-baking after exposure and developing at a temperaturehigher than hundred and several tens degree. However, a large amount ofa sublimated material originated from an initiator adheres to the insideof a heater and falls on a product obtained by curing duringpost-baking, causing product defects, posing a serious problem. Also, adecomposed material of an initiator or the like is involved in theatmosphere around the heater, posing a problem from the viewpoint ofoperational safety.

It is possible to remove more residues originated from a radicalinitiator by changing a post-baking condition to a condition of ahigher-temperature and longer-operation time. However, it is difficultto remove the residues completely because of volatilization from asolid. If the condition is made stricter to remove many more impuritiesoriginated from a radical initiator, this condition rather causesproduct defects.

Secondary, use of resist for peeling films can be exemplified. Similarlyto that of the above-mentioned solder resist, resist for processingelectronic members, dry film resist or the like to be used for peelingfilms employ the photocuring system. The resists for processing arepeeled and do not remain in the products finally, however, in theprocessing steps of copper wiring formation, the residues derived fromthe initiators from the resist films are eluted in chemical solutionssuch as ferric chloride, cupric chloride or the like to be used for theprocessing to shorten the chemical solution life.

Moreover, thirdly, use for coating material for protecting films can beexemplified. When a photosensitive resin is used as a wall used forbuildings or paint for a protective layer protecting a surface of wallpaper, there is a demand for decreasing solvent components or odorouscomponents emitting from whole building material with the view ofdealing with sick house syndrome. There is a problem that the use of ahighly volatile initiator causes the occurrence of odors even aftercuring.

As one of the means for solving the above-mentioned problems, ESACUREKIP 150 (trade name) is commercialized by Nihon Siber Hegner K. K. TheESACURE KIP 150 has a structure in which photoradical generationportions are introduced in the side chains of the polymer skeleton. Withsuch a structure, the photoradical generator has a plurality of radicalgeneration portions in one molecule and therefore, if any one portion ofthe molecule is made radical and bonded with the matrix of the coatinglayer, the unreacted radical generation portions existing in the samemolecule are bonded to the matrix structure and thus are not volatilizedin post-baking and do not move in the coating layers to scarcelydeteriorate the reliability of the final products.

However, ESACURE KIP 150 has a polymer skeleton with relatively largemolecular size and therefore is difficult to move in a photosensitiveresin composition. Further, the sensitive wavelength is not matched withthe radiation wavelength of common light sources. Therefore, thesensitivity in the resin composition is not so high in practical use andthe photoradical reactivity is hard to be increased.

As another solution, LUNA 750 (trade name) is commercialized by NihonSiber Hegner K. K. The LUNA 750 is produced by introducing functionalgroups (side chains) with high molecular weight into self-cleavage typeradical-generating parts having α-aminoacetophenone skeleton to increasethe molecular weight of the parts to be isolated by cleavage at the timeof radical generation and thus volatilization (outgas) of decompositionmaterials can be suppressed. However, in this case, the molecular weightin the cleaved parts is increased only to increase the temperature ofthe volatilization and make gasification difficult, the decompositionmaterials independent from the matrix structure of the coating layerremain in the coating layer. Therefore, it cannot sufficiently solve theproblems of reliability deterioration, e.g. inferior products owing tothe decomposition materials, occurrence of volatilization, elution, andodor emission of the decomposition materials, of the final products ofcoating layers or the like. Also, it cannot deal with the problem ofelution of decomposition materials or unreacted materials derived fromthe initiators to developers or washing solutions in the case ofdevelopment or washing intermediate products and final products.

SUMMARY OF THE INVENTION

It is an object of the present invention to solve the above-mentionedproblems which a self-cleavage type photoradical generator has. Moreparticularly, the first object of the present invention is to provide aradical generator having sensitivity as high as that of a conventionalself-cleavage type initiator and capable of suppressing volatilizationof low molecular weight decomposition materials and odor emission fromresin composition or an intermediate product at the time of lightirradiation or post-baking and leaving practically no low molecularweight decomposition material independent from the matrix of a curedproduct in the final product after photocuring.

The second object of the present invention is to provide aphotosensitive resin composition containing the above-mentioned radicalgenerator and scarcely evaporating low molecular weight decompositionmaterials and generating odor at use and leaving little residues of thelow molecular weight decomposition materials in the final product afterphotocuring.

The third object of the present invention is to provide an articlehardly deteriorated by heat and having high heat resistance andstability and comprising at least a portion formed by using theabove-mentioned photosensitive resin composition.

To solve the above-mentioned problems, a photoradical generator producedaccording to the invention contains a compound (a) having one or moreself-cleavage type radical-generating parts and one or more ethylenicunsaturated groups in one molecule.

The photoradical generator of the present invention has a function as aself-cleavage type radical generator and a function as a curablereactive compound.

When light is irradiated to the photoradical generator of the presentinvention, the self-cleavage type radical-generating parts are cleavedto generate radicals. The segments produced at that time have ethylenicunsaturated groups, so that they are bonded to and fixed in a matrixstructure of the cured product by polymerization reaction of theethylenic unsaturated groups. Accordingly, the production amount of thelow molecular weight decomposition materials existing independently formthe matrix of the cured product is slight.

Accordingly, the amount of the low molecular weight decompositionmaterials volatilized at the time of light irradiation or post-baking isconsiderably decreased and particularly odor is lessened. Also, theamount of decomposition materials to be deposited on a productionapparatus or a product by re-condensation after volatilization or theamount of decomposition materials to be eluted to a development solutionor a washing solution is considerably decreased. Further, the amount oflow molecular weight decomposition materials remaining after the curingis decreased to remarkably improve the heat resistance and stability ofthe final product.

The molecular size of the photoradical generator of the presentinvention before radical reaction is much smaller than those ofpolymers. Therefore, the photoradical generator has high compatibilitywith and solubility in monomer components and other components such assolvents and relatively easily and freely moves in a photosensitiveresin composition. Accordingly, it has sensitivity as high as those ofconventional self-cleavage type photoradical generators.

Next, a photosensitive resin composition according to the inventioncontains the above-mentioned photoradical generator of the presentinvention as an essential component.

When the resin composition of the present invention is applied inprescribed patterns or formed in a prescribed shape and subjected tolight irradiation, photoradical reaction is started and various radicalreactions such as radical polymerization are promoted to cure thecomposition and/or change the solubility. At the radical reaction, thephotoradical generator containing the compound (a) works as aself-cleavage type radical generator to efficiently generate radicals toprovide high sensitivity.

Further, at least one of segments produced by the cleavage of thecompound (a) is bonded to the matrix of the cured product by thereaction of the ethylenic unsaturated groups to form a portion of thechemical structure of the product. Accordingly, the amount of the lowmolecular weight decomposition materials derived from the radicalgenerator is extremely decreased as compared with that of the case ofusing a conventional self-cleavage type radical generator. Subsequently,the amount of the low molecular weight decomposition materialsvolatilized at the time of exposure or post-baking is considerablydecreased and particularly odor is lessened. Also, the problems ofre-condensation of the volatilized low molecular weight decompositionmaterials or elution of them to a development or the like can beimproved.

Further, since the amount of low molecular weight decompositionmaterials remaining in the final product is slight, heat resistance andstability are effectively improved. Accordingly, the problem ofreliability decrease of the final product can be solved.

When the photosensitive resin composition is used as a pattern-formingmaterial, a paint or printing ink, or a formation material for a colorfilter, an electronic part, an interlayer insulation film, a wire coverfilm, an optical material, an optical circuit, an optical circuit part,an antireflection film, a hologram, or a forming material for buildingmaterial, the product or film is provided with high heat resistance andhigh stability. Also, since no odor is emitted at the time of exposure,the work environments are improved.

The photoradical generator of the present invention has self-cleavagetype high reaction potential and is capable of suppressing production ofthe low molecular weight decomposition materials. According to theinvention, odor emission, which is one of the problems of self-cleavagetype radical generators, can be lessened.

Particularly, in the case that a photoradical generator contains anaromatic component such as benzaldehyde said to be a cause of strongodor among odorous components, the aromatic component is fixed in thematrix to remarkably increase the odor lessening effect.

Accordingly, the photoradical generator of the present invention can beused as a photoradical generator for starting and promoting the radicalreaction such as radical polymerization by excitation by lightradiation.

Also, since the photoradical generator of the present invention has afunction as a self-cleavage type radical generator and a function as apolymerizable compound, the photoradical generator itself can be usedpreferably as a curable reactive component having the photoradicalinitiation.

Since the photosensitive resin composition of the present inventioncontains the photoradical generator of the present invention as aninitiator, the composition has sufficient sensitivity for practical useand although using the self-cleavage type radical generator, thecomposition generates little low molecular weight decompositionmaterials as by-products. Particularly, the composition has asignificant effect to decrease odor. Further, since the amount of thelow molecular weight decomposition materials remaining in the finalproduct is low, the final product obtained has high heat resistance,high stability and high reliability.

Since a printed matter, a color filter, an electronic part, aninterlayer insulating film, a wire cover film, an optical member, anoptical circuit, an optical circuit part, a antireflection film, ahologram, or a building material relevant to the invention has at leasta portion of a cured product of the photosensitive resin compositionwith high heat resistance and high stability, such a product or film isprovided with high heat resistance and high stability and thus theproduction yield of the product or film is also increased.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, the invention will be described in detail. The radiationlight to be used for causing the photoradical generation process in thepresent invention may include not only visible light and electromagneticwave with wavelength in non-visible region capable of radicalizing theradical generation positions of the photoradical generator or causingradical reaction of the photosensitive resin composition but alsoparticle beam such as electron beam and radiation beam or ionizedradiation ray which is a general term of electromagnetic wave andparticle beam. To cure the resin composition, mainly electromagneticwave with wavelength of 2 μm or shorter, electron beam, and ionizedradiation ray or the like may be used.

At first, a photoradical generator of the present invention will bedescribed. The photoradical generator according to the inventioncomprises a compound (a) having one or more self-cleavage typeradical-generating parts and one or more ethylenic unsaturated groups inone molecule.

The above-mentioned compound (a) has one or more self-cleavage typeradical-generating parts and one or more ethylenic unsaturated groups inone molecule and has a function as a self-cleavage type radicalgenerator and a function as a curable reactive compound.

The self-cleavage type radical-generating parts of the photoradicalgenerator in the present invention mean parts which are excited by lightabsorption and generate radicals along with decomposition of themolecular structure (cleavage of the bonding), that is, parts havingradical generation mechanism classified in Type I. Examples of theself-cleavage type radical-generating parts are structures formed byremoving one or more hydrogen atoms at the positions to be bonded withthe ethylenic unsaturated groups from the compounds having radicalgeneration mechanism in Type I such as benzophenone derivatives, benzylketals, α-acetoxyphenone, α-aminoacetophenone, acylphosphine oxides,titanocenes, α-acyloxime or the like.

In general, a self-cleavage type photoradical initiator generates lowmolecular weight decomposition materials by cleavage of molecularstructure at the time of radical generation. As one example,α-aminoacetophenone skeleton known as a highly sensitive self-cleavagetype photoradical-generating part produces a benzoyl radical and anamino radical when it is excited by light and intermolecular cleavage iscaused. The polymerization reaction is supposed to start by drawinghydrogen of an object to be reacted (a raw material compound) by theamino radical or the benzoyl radical.

Principally, the respective radicals are possible to be bonded to theends of the object at the time of starting polymerization, however,practically, they draw hydrogen from molecules existing in thesurrounding to generate radical and become inactive themselves in thecleaved state as they are and tend to be decomposition materialsindependent from the molecules of the polymer. The low molecular weightdecomposition materials produced by the cleavage of the self-cleavagetype photoradical-generating parts cause such problems as to emit gasesand odor by volatilization at the time of light radiation orpost-baking, to deposit on a production apparatus or a product byre-condensation after volatilization or to remain in the final productto deteriorate the heat resistance and stability of the product withoutbeing volatilized.

Particularly, the benzoyl radical tends to be benzaldehyde or itsanalogs by drawing hydrogen of surrounding molecules and is difficult tobe bonded to the matrix in the vicinity. Having strong odor,benzaldehyde and its analogs become major causes of odor at the time oflight radiation and post-baking and moreover since they are difficult tobe volatilized completely at the time of post-baking, they remain in thefinal product and become causes of odor or deterioration of the product.

On the contrary to such a conventional self-cleavage type photoradicalinitiator, the compound (a), a photoradical generator of the presentinvention, has ethylenic unsaturated groups in the portions to besegments by the cleavage of the self-cleavage typephotoradical-generating parts. Therefore, if the photoradical reactionis started and promoted by using the compound (a) as the photoradicalinitiator, the segments produced by the cleavage of the self-cleavagetype photoradical-generating parts are bonded to the matrix structure ofthe cured product through the ethylenic unsaturated groups and fixedtherein.

As a result, the amount of the low molecular weight decompositionmaterials volatilized at the time of light radiation and post-baking issignificantly decreased and particularly odor is lessened. The amount ofthe decomposition materials to deposit on a production apparatus byre-condensation after volatilization or the amount of the decompositionmaterials to be eluted to a development solution or a washing solutioncan considerably be decreased. Further, the amount of the low molecularweight decomposition materials remaining after curing is decreased andthus the heat resistance and stability of the final product areremarkably improved.

Also, most of the segments produced by cleavage of the compound (a) arebonded to polymerization or crosslinking matrix structure to form aportion of large molecular weight, however, the molecular size beforethe radical reaction is much smaller than polymers. Therefore, they havehigh compatibility with and solubility in monomer components and othercomponents such as solvents and can relatively easily and freely move ina photosensitive resin composition. Accordingly, a resin compositionhaving sensitivity as high as those of conventional self-cleavage typephotoradical initiators and sufficient reactivity for practical use canbe obtained.

As the compound (a) having one or more self-cleavage typeradical-generating parts and one or more ethylenic unsaturated groups inone molecule, for example, a compound (a1) represented by the followingformula (1) can be used:

wherein R¹, R², and R³ respectively represent a hydrogen atom, a halogenatom, or a monovalent organic group; X represents a divalent group; andY represents a monovalent group.

The compound (a1) has self-cleavage type radical-generating part definedas —(C═O)—Y and generates two radicals by cleavage of the bond betweenthe carbonyl carbon and the monovalent Y group. Between the producedradicals, if the segment having the benzoyl radical structure isinactivated and becomes benzaldehyde or its analogs having independentmolecular structure, these compounds are easily volatilized to causeodor. On the other hand, the ethylenic unsaturated group of the compound(a1) is bonded to the portion to be the segment having the benzoylradical structure, benzaldehyde or its analogous compound structuremainly causing odor are fixed to the matrix structure of the curedproduct. Accordingly, in this case, the production amount of stronglyodorous low molecular weight decomposition materials is suppressed toextremely low to efficiently decrease odor emission.

R¹, R², and R³ existing in the ethylenic unsaturated group of thecompound (a1) respectively represent a hydrogen atom, a halogen atom, ora saturated or unsaturated monovalent organic group. The monovalentorganic group may contain heteroatom other than carbon and/orsubstituents. R¹, R², and R³ respectively represent preferably ahydrogen atom, a halogen atom, a saturated or unsaturated alkyl, asaturated or unsaturated halogenated alkyl, or a saturated orunsaturated hydroxyalkyl and particularly preferably a hydrogen atom, ahalogen atom, a methyl group, a trifluoromethyl group, or ahydroxymethyl group. Particularly, in terms of the cost, rate of radicalreaction, and physical properties of the final coating layer, theethylenic unsaturated group is most preferably having a hydrogen atom, ahalogen atom, a methyl group, a trifluoromethyl group or a hydroxymethylgroup for R¹ and a hydrogen atom or fluorine atom for R² and R³,respectively.

Preferable examples of the ethylenic unsaturated group are an acryloylgroup, a methacryloyl group, a 2-trifluoromethylacryloyl group and anunsubstituted vinyl group.

In the above formula (1), the monovalent group Y contained in theself-cleavage type photoradical-generating part may have a structurecontaining, for example, an aliphatic ether or aliphatic amine skeletonand is preferably a group having an aliphatic tertiary amine structure.

The chemical structure “X” bonded to the ethylenic unsaturated group andthe self-cleavage type radical-generating part in the formula (1) may beany chemical structure having di- or more valences and typically adivalent organic group having, for example, a chemical structure definedby the following formula (2):—X2-X1-X3-  Formula (2)

In the divalent organic group presented by the above formula (2), X1represents a divalent organic group, X2 may be a bond possible to bebonded to the ethylenic unsaturated group, and X3 may be a bond possibleto be bonded to the benzoyl structure.

The structure of the divalent organic group X1 is not particularlylimited. Practically, it is preferably a straight, branched, or cyclicalkylene group having 1 to 15 carbon atoms. Additionally, thesesaturated alkylene groups may have aliphatic and/or aromatic cyclicparts and/or additional structures composed of one or more bonds incombinations such as ester bond, ether bond, thioether bond, amino bond,amide bond, urethane bond, urea bond, thiocarbamate bond, carbodiimidebond, carbonate bond or the like, in the middle of the carbon skeleton.The divalent organic group X1 may be a polymer chain composed of acertain repeating unit just like a polycaprolactone structure of thelike.

The structure X2 possible to be bonded to the ethylenic unsaturatedgroup may include practically a single bond, ester bond, etherbond,thioetherbond, amino bond, amide bond, urethane bond, urea bond,thiocarbamate bond, carbodiimide bond, carbonate bond or the like,however, it is not particularly limited if it is a known divalent bond.

In terms of the price and availability and easiness of synthesis, X2 ispreferably a single bond, ester bond, ether bond, thioether bond, aminobond, amide bond, urethane bond, urea bond, thiocarbamate bond,carbodiimide bond, carbonate bond or the like.

The structure X3 possible to be bonded to the benzoyl structure may havea similar structure as the above-mentioned structure X2 and ispreferably a group adjusting the absorption wavelength of the compound(a1) and increasing the absorption of the radiation wavelength.

A more particular example of the compound categorized in the compound(a1) represented by the formula (1) is compound (a3) represented by thefollowing formula (3):

wherein R¹, R², and R³ respectively represent a hydrogen atom, a halogenatom, or a monovalent organic group; R⁴ and R⁵ respectively represent ahydrogen atom or an alkyl having 1 to 15 carbon atoms (preferably 1 to 6carbon atoms); R⁶ and R⁷ respectively represent a monovalent organicgroup and may have hetero atoms such as O, N, S, Si or the like otherthan C; R⁶ and R⁷ may bonded to each other to form a ring structure; X1represents a divalent organic group; X2 and X3′ independently representa divalent group.

The compound (a3) has a structure comprising S (sulfur) bonded to thepara-position of the benzoyl structure and a tertiary amine structurebonded to the carbonyl carbon of the benzoyl structure through amethylene group optionally substituted with alkyl. The structure hashigh radical generation capability. In general, when an S-containingbenzoyl radical becomes inactive and a benzaldehyde analog havingindependent molecular structure is produced, it is volatilized and emitsvery strong odor. On the other hand, in the case of using the compound(a3), even if benzoyl radical is generated, the S-containingbenzaldehyde analog is not volatilized to significantly suppress odor.

The amino radical produced together with the benzoyl radical has highcapability of initiating the radical chain reaction and therefore, inthe case that this portion can move freely in the reaction system,particularly high sensitivity can be obtained. In the case of using thecompound (a3), since no ethylenic unsaturated group exists in the aminoradical, the amino radical can move freely in the photosensitive resincomposition. Accordingly, high sensitivity can be obtained.

A more particular example of the compound categorized in the compound(a3) represented by the formula (3) is compound (a4) represented by thefollowing formula (4):

wherein R¹ to R⁷ respectively represent same as those of the formula(3); n is an integer of 0 to 15, more preferably an integer of 0 to 8.

The tertiary amine structure portion of the compound (a4) has amorpholine skeleton. The amino radical produced from the compoundbecomes morpholine with independent molecular structure or its analogand volatilized when it finally becomes inactive, however, the odor ofmorpholines is weak as compared with the odor of benzaldehydes.Accordingly, undesirable effects on work environments are scarce. Also,since morpholines have high volatilization property, they can easily beremoved from the product in the production process such as lightradiation, post-baking or the like and scarcely remain. Consequently,the decomposition materials having morpholine structure scarcelydeteriorate the heat resistance, stability, and reliability of the finalproduct.

To improve the radiation sensitivity of the compound (a), which is thephotoradical generator of the present invention, it is desirable for theradical generation parts contained in the compound to be excited byradiated light and for the compound to have the chemical structure easyto generate radicals. For that, it is supposed effective to properlyselect the substituent groups (e.g. the above-mentioned R⁴ to R⁷)contained in the compound (a) and the bonding structure (e.g. theabove-mentioned X) to shift the light absorption wavelength or changethe absorption coefficient.

In order to obtain practical sensitivity, it is preferable to make aselection of the substituent groups and the bonding structure so that apart of the absorption wavelength of the compound (a) overlaps on any ofthe emitting wavelengths of an exposure light source (irradiation lightsource) in a process. The absorption maximum of the compound (a) fallswithin a range of particularly preferably ±20% and still more preferably±10% of the emitting wavelength closest to the absorption maximum.

The molar extinction coefficient of the compound (a) in any of theemitting wavelengths of an exposure light source (irradiation lightsource) in a process is preferably 0.1 or more from the viewpoint ofsensitivity. Here, the molar extinction coefficient ε is given by therelationship induced from the Lambert-Beer rule and expressed by thefollowing formula:A=εcbwhere:A=Absorbance;b=Length of an optical path in an example (cm); andc=Concentration of a solute (mol/L).

Generally, when a change in absorbance is recorded using a solutionhaving the same concentration and a cell having the same length of anoptical path with changing the wavelength of incident light, theabsorbance varies according to the wavelength, showing a maximum molarextinction coefficient ε_(max) at a wavelength specific to a compound tobe a subject of measurement. The aforementioned term “the molarextinction coefficient of the above-mentioned compound in the exposurewavelength is 0.1 or more” implies that the molar extinction coefficientwhen measured using a wavelength adopted when carrying out exposure byusing the compound is 0.1 or more but does not imply that the maximummolar extinction coefficient ε_(max) is 0.1 or more.

In the case of a usual high pressure mercury lamp, there are threesignificant emissions at 365 nm (i rays), 405 nm (h rays) and 436 nm (grays). However, in actual, emissions are also present at, for instance,333 nm or the like. Therefore, a photo-crosslinking compound may haveabsorption maximum in the vicinity of these wavelengths. Also, whenirradiating with an F2-excimer laser (157 nm), ArF excimer laser (193nm), KrF excimer laser (248 nm) or the like, the photo-crosslinkingcompound may have absorption in the vicinity of these wavelengths.Specifically, the absorption maximum around 365 nm falls in a range ofpreferably 365±73 nm and more preferably 365±37 nm.

When the absorption wavelength is overlapped with at least one of theregions around 157 nm, 193 nm, 248 nm, 365 nm, 405 nm, and 436 nm, whichare main emitting wavelength values of the above-mentioned widelyemployed exposure light sources, the wavelength is convenient to be usedas the exposure wavelength and it is particularly preferable that themolar absorbance coefficient at the wavelength is 0.1 or more.

If the absorption wavelength is overlapped on the region covering atleast one wavelength among 157 nm, 193 nm, 248 nm, 365 nm, 405 nm and436 nm which are major emitting wavelengths of the above-mentionedwidely employed exposure light sources, this is convenient to utilizethese wavelengths as exposure wavelengths. It is particularly preferablethat the molar extinction coefficient at this wavelength is 0.1 or more.

THE INTERPRETATION OF THE ULTRAVIOLET SPECTRA OF NATURAL PRODUCTS (A. I.Scott, 1964) and the table described in THE ORGANIC COMPOUNDIDENTIFICATION METHOD BY A SPECTRUM, fifth edition (R. M. Silverstein,1993) may be used as the references showing a guide to determine as towhat substituent is introduced to shift the absorption wavelength to adesired wavelength.

In the case of using the photoradical generator containing theabove-mentioned compound (a) of the present invention, the segmentgenerated by the cleavage of the self-cleavage typephotoradical-generating parts is bonded to the matrix structure of thecured product through the ethylenic unsaturated group and therefore, lowmolecular weight decomposition materials with high volatile property andindependent from the matrix structure scarcely remain. Accordingly, thestability of the finally obtained cured film is improved and thelight-resistance of the coating layer from being impaired and coloring,fading, peeling and cracks of the coating layer can be prevented.

In terms of the heat resistance, the 5% reduction in weight temperatureof the photoradical generator according to the invention is preferably50° C. or more, more preferably 100° C. or more, and even morepreferably 130° C. or more.

The 5% reduction in weight temperature means the temperature at the timewhen the weight of a sample is decreased by 5% from the initial weightin the case that the weight reduction is measured by a thermogravimetricanalysis in the same technique as that employed in Example of thepresent invention described later. Similarly, the 10% reduction inweight temperature means the temperature at the time when the weight ofa sample is decreased by 10% from the initial weight.

The above-mentioned photoradical generator is preferable to have highsolubility in the case of adding it to a resin composition in terms ofthe coatability, transparency after curing, and sensitivity at the timeof exposure.

In terms of the coatability, the photoradical generator is particularlypreferable to have high solubility in a solvent. Practically, thesolubility of the photoradical generator in a solvent to be used,particularly, a widely used solvent, which will be described later, ispreferably 0.1% by weight or more.

Further, even if a resin composition obtained by dissolution in asolvent is transparent, the compatibility of the contained solids withone another is low, precipitates are formed in the coating layer duringdrying of the coating layer to make it difficult to obtain sufficienttransparency. Therefore, in the case that a coating layer or molded bodywith high transparency such as an optical member is required, aphotoradical generator with high compatibility with other solidcomponents in the resin composition, particularly with the radicalreactive compound such as compounds having the ethylenic unsaturatedgroups, is preferable to be used. When high transparency is required,the all ray-transmittance (JIS K 7105) is preferably 90% or more, morepreferably 95% or more, in the case the film thickness of the coatinglayer formed by curing the resin composition is 10 μm.

When the solubility of the photoradical generator in the radicalreactive compound is high, the function as the initiator is improved, sothat the sensitivity at the time of exposure is increased high. Fromthat point, in the case the solubility is evaluated by using methylacrylate as a typical monomer component, the saturation concentration ofthe photoradical generator in the methyl acrylate at 20° C. ispreferably 0.01 mol/L or more.

The solubility or compatibility of the photoradical generator can beimproved by properly selecting the substituent groups (e.g. theabove-mentioned R⁴ to R⁷) or the bonding structure (e.g. theabove-mentioned “X”) of the compound (a) in consideration of the solventto be dissolved or other solid components to be compatible with. Forexample, in the case a carboxyl group is selected as a substituentgroup, the photoradical generator becomes easy to be dissolved in waterand organic polar solvent and in the case that ester is introduced, thesolubility in a solvent and a compound having ester bond is improved.

The compound (a), the photoradical generator of the present invention,can be synthesized by various known methods. Examples of such methodsare a method of synthesizing a compound having self-cleavage typeradical-generating parts at first and then introducing ethylenicunsaturated groups into the compound; and a method of at firstintroducing ethylenic unsaturated groups into a precursor which can beinduced into the structure of the self-cleavage type radical-generatingparts and then inducing a portion of the precursor into theself-cleavage type radical-generating parts, however the methods are notparticularly limited.

A method of synthesizing a compound represented by the above-mentionedformula (a4) will be exemplified more particularly, however, it is notintended that the invention be limited to the exemplified method.

As a raw material, a self-cleavage type radical generator comprising asubstituent group having active hydrogen such as a hydroxyl group, anamino group or the like is used. The above-mentioned active hydrogen issubstituted with an ethylenic unsaturated group. Such a raw material isnot particularly limited, and a compound obtained by modifying thebenzophenone portion of α-aminoacetophenone with caprolactone can beused. Those containing one or several caprolactone groups in thecaprolactone-modified portion may be used. There is LUNA 750 (productname; manufactured by Nihon Siber Hegner K. K.) made available as acommercialized product of such caprolactone-modifiedα-aminoacetophenone.

Next, the above-mentioned raw material compound and triethylamine aremixed and stirred with dehydrated tetrahydrofuran (THF). Acrylic acidchloride is gradually added to the mixture until no raw material spot ofthe raw materials is found in the resulting reaction solution by thinlayer chromatography and if required, the reaction solution issuccessively stirred at room temperature for about 1 to 15 hours. Thereaction solvent is not limited to the above-mentioned tetrahydrofuranand any solvents such as organic polar solvents or the like in which thefinal product can be dissolved may be used. If the reaction solvent isdehydrated, the yield is improved and therefore it is preferable.

After the stirring, the reaction solution is moved to a solutionfiltration funnel and treated with 1N HCl to transfer triethylamine to awater layer. After separation of the water layer and an oil layer, theoil layer is further treated with a saturated NaHCO₃ solution totransfer acrylic acid derived from the unreacted acrylic acid chlorideto the water layer, thus, the water layer and an oil layer areseparated. The separated oil layer is dehydrated by a proper dehydratorsuch as magnesium sulfate or the like and filtered. The product obtainedby distillation removal of the solvent from the obtained filtrate isrefined by column chromatography or re-crystallization to obtain anaimed product.

The photoradical generator of the present invention obtained in such amanner has a self-cleavage type high reaction potential (highsensitivity) and also high capability of fixing segments derived fromthe photoradical initiator in the matrix and excellent solubility insolvents or monomer components, so that it can be used as a photoradicalgenerator for initiating and promoting the radical reaction such asradical polymerization by being excited by light radiation. Since thephotoradical generator of the present invention has a function as aself-cleavage type photoradical initiator and a function as apolymerizable compound and therefore is preferably used itself as acurable reactive component having photoradical initiator.

Next, a photosensitive resin composition (hereinafter, simply referredto as resin composition) according to the invention will be described.

The resin composition of the present invention contains theabove-mentioned photoradical generator as an essential component, andbased on necessity, further a compound (b) having an ethylenicunsaturated group, a radical-reactive compound other than the compound(b) or a curable reactive compound other than the radical-reactivecompound, a binder component with high molecular weight, a hydrogendonor, a radical generator other than the compound (a) or othercomponents.

When the resin composition of the present invention is applied inprescribed patterns or formed in a prescribed shape and subjected tolight radiation, photoradical reaction starts and various radicalreactions such as radical polymerization, radical dimerization, radicalcrosslinking and the like proceed to cure the composition and/or changethe solubility. At the time of the radical reactions, the photoradicalgenerator containing the compound (a) works as the self-cleavage typeradical generator to efficiently generate radicals, so that highsensitivity can be obtained. Further, since the compound (a) has atleast one ethylenic unsaturated group, at least one of the segmentsproduced by cleavage is bonded to the matrix of the cured product by thereaction of the ethylenic unsaturated group to form a portion of thechemical structure. As a result, the amount of the low molecular weightdecomposition materials derived from the radical generator isconsiderably decreased as compared with that in the case of using aconventional self-cleavage type radical generator. Accordingly, thevolatilization amount of the low molecular weight decompositionmaterials is decreased at the time of exposure and post-baking to lessenodor and suppress re-condensation of the volatilized low molecularweight decomposition materials. Also, since the formed body or coatinglayer after curing contains a little amount of the low molecular weightdecomposition materials existing independently from the matrix, the heatresistance and the stability are heightened. Consequently, the problemof decrease of reliability of the final product can be solved.

Further, since the photoradical generator containing the compound (a)has the ethylenic unsaturated group and works as a radical reactivecompound, a resin composition having photo-curability can be obtainedwithout adding other radical reactive compounds.

Here, the crosslinking means that a crosslinking bond is generated,wherein the crosslinking bond means a bond formed in such a manner as tobuild a bridge between optional two atoms among a molecule consisting ofatoms bound chain-wise. The bond in this case may be formed in the samemolecule or between different molecules (CHEMICAL HANDBOOK, Tokyo KagakuDojin Co., Ltd., p. 1082). The chains may include alicyclic structures.

Conventionally, the compound (b) having the ethylenic unsaturated grouphas been used popularly as a curable reactive compound which isradically polymerizable in a wide range of uses and is also usedpreferably in the present invention. As the compound (b), compoundshaving one or more ethylenic unsaturated groups and compounds having atleast one ethylenic unsaturated groups and other functional groups canbe used and examples of the compound are the above-mentioned ethylenicunsaturated group-containing compounds and further aromatic vinylcompounds such as an amide type monomer, a (meth)acrylate monomer, anurethane (meth)acrylate oligomer, a polyester (meth)acrylate oligomer,an epoxy (meth)acrylate, and a hydroxyl group-containing (meth)acrylate.Herein, the (meth)acrylate means either acrylate or methacrylate.

Examples of the amide type monomer are amide compounds such asN-vinylpyrrolidone, N-vinylcaprolactam, acryloylmorpholine or the like.

Examples of the (meth)acrylate monomer include imide acrylates such ashexahydrophthalimideethyl acrylate, succimideethyl acrylate or the like;hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate,2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-phenylpropyl acrylate or thelike; acrylates of alkylene oxide addition compounds of phenol and theirhalogen substituted compounds such as phenoxyethyl (meth)acrylate or thelike; glycol mono or di(meth)acrylates such as ethylene glycol mono ordi(meth)acrylate, methoxyethylene glycol mono(meth)acrylate,tetraethylene glycol mono or di(meth) acrylate, and tripropylene glycolmono or di(meth) acrylate or the like; (meth) acrylic acid esters ofpolyols and their alkylene oxides such as trimethylol propane tri(meth)acrylate, pentaerythritol tri(meth) acrylate, pentaerythritoltetra(meth)acrylate, and dipentaerythyritol hexaacrylate or the like;and isocyanuric acid EO-modified di or tri(meth)acrylate or the like.

Examples of the urethane (meth)acrylate oligomer include reactionproducts-obtained by causing reaction of reaction products of polyolsand organic polyisocyanates with hydroxyl group-containing(meth)acrylate or the like.

Herein, examples of the polyols include low molecular weight polyols,polyether polyols, polyester polyols or the like. Examples of the lowmolecular weight polyols are ethylene glycol, propylene glycol,cyclohexane dimethanol, 3-methyl-1,5-pentanediol or the like; examplesof the polyether polyols are polyethylene glycol, polypropylene glycolor the like; and examples of the polyester polyols are reaction productsof these low molecular weight polyols and/or polyether polyols with acidcomponents of dibasic acids such as adipic acid, succinic acid, phthalicacid, hexahydrophthalic acid, and terephthalic acid and theiranhydrides.

Examples of the organic polyisocyanates to be reacted with theabove-mentioned polyols include tolylene diisocyanate,4,4′-diphenylmethane diisocyanate, 4,4′-dicylcohexylmethanediisocyanate, hexamethylene diisocyanate, isophorone diisocyanate or thelike.

Examples of the polyester (meth) acrylate oligomer include dehydrationcondensation products of polyester polyols and (meth)acrylic acid.Examples of the polyester polyols are reaction products of low molecularweight polyols such as ethylene glycol, polyethylene glycol, cyclohexanedimethanol, 3-methyl-1,5-pentanediol, propylene glycol, polypropyleneglycol, 1,6-hexanediol, trimethylolpropane or the like and polyols ofalkylene oxide addition products of these polyols with acid componentsof dibasic acids such as adipic acid, succinic acid, phthalic acid,hexahydrophthalic acid, and terephthalic acid and their anhydrides.

Examples of the epoxy (meth)acrylate include compounds obtained byaddition reaction of epoxy resins with unsaturated carboxylic acid suchas (meth)acrylic acid or the like and practically include epoxy(meth)acrylate of bisphenol A type epoxy resin, epoxy (meth)acrylate ofphenol or cresol novolac type epoxy resin, and addition reactionproducts of (meth) acrylic acid with diglycidyl ether which is apolyether.

The compound having an ethylenic unsaturated group is preferable to havetwo or more ethylenic unsaturated groups, more preferably 3 or moreethylenic unsaturated groups in terms of three-dimensional crosslinkingof the radical polymerizable compounds or radical reactive compoundsother than the radical polymerizable compounds.

When the resin composition is used as resist for forming patterns byexposure for electronic parts, color filters or the like, to improve thealkali developing ability of the resin composition, compounds havingalkali-soluble or hydrophilic functional groups such as a carboxylgroup, a phenolic hydroxyl group, a sulfonic acid group, a hydroxylgroup or the like may be used as the compound (b) having an ethylenicunsaturated group.

Also, it is preferable for the radical reactive curable component suchas the compound (b) or the like to have no absorption in the wavelengthregion where the radiation wavelength and the absorption wavelength ofthe self-cleavage type radical-generating parts are overlapped so as notto interfere the sensitivity of the resin composition to be subjected tothe light radiation.

The photosensitive re sin composition of the present invention maycontain a macro molecular compound or a curable reactive compound havinga reaction form other than radical reaction as the binder resin tocontrol the film forming property of the composition put in an uncuredstate and the physical properties of the coating layer after cured.

As the above mentioned binder resin, any of well known macro molecularcompounds and curable reactive compounds having the reaction for motherthan radical reaction may be used depending on the use of the resincomposition. As the macro molecular compounds, non-reactive polymers andpolymers having curable reactive groups such as ethylenic unsaturatedgroups or the like may be used.

Examples, any kinds of well known macro molecular compounds or curablereactive compounds such as organic polyisocyanates, such as tolylenediisocyanate, 4,4′-diphenylmethane diisocyanate,4,4′-dicylcohexylmethane diisocyanate, hexamethylene diisocyanate,isophorone diisocyanate or the like; polymers and copolymers of acrylicor vinyl compounds such as vinyl acetate, vinyl chloride, acrylic acidester, methacrylic acid ester or the like; styrene type resin such aspolystyrene or the like; acetal resin such as formal resin, butyralresin or the like; silicone resin; phenoxy resin; epoxy resin such asbisphenol A type epoxy resin or the like; urethane resin such aspolyurethane or the like; phenol resin; ketone resin; xylene resin;polyamide resin; polyimide resin; polyether resin; polyphenylene etherresin; polybenzoxazole resin; cyclic polyolefin resin; polycarbonateresin; polyester resin; polyallylate resin; polystyrene resin; novolacresin; alicyclic polymers such as polycarbodiimide, polybenzoimidazole,polynorbornane or the like; and siloxane type polymers are included.

These macro molecular compounds and curable reactive compounds otherthan the radical reactive compounds may be used alone or in combinationof two or more. The macro molecular compound, which is a bindercomponent, is generally preferable to have a weight average molecularweight of 3,000 or more, although it depends on uses of the resincomposition. If the molecular weight is so high, it results indeterioration of the solubility and the processability and therefore,the weight average molecular weight is generally preferable to be10,000,000 or less.

The amount of the photoradical generator of the present invention in theresin composition is required to be enough to obtain sufficient radicalgeneration amount in order to assure a desirable rate of curing and ahigh crosslinking density and to improve the strength of the coatinglayer and the glass transition temperature and from such a viewpoint,the amount of the photoradical generator is preferably 0.1% by weight ormore of the total amount of solids in the resin composition. Further, interms of the radiation sensitivity and physical properties of thecoating layer, the amount of the photoradical generator is preferably 1%by weight or more of the total amount of solids in the resincomposition. The solids in the photosensitive resin composition are allcomponents other than the solvent and include liquid phase monomercomponents.

The compound (b) having an ethylenic unsaturated group is preferably inan amount of 1% by weight of the whole solid content of the resincomposition to obtain sufficient photo-curability. The mixing ratio ofother radical generator to the compound (b) and other radical reactivecompounds may properly be selected depending on the types and amounts ofthese radical reactive compounds or the uses of the resin composition.

When the binder resin of a macro molecular compound or curable reactivecompound other than radical reaction compound is used, the amount ispreferably 1% by weight or more and 97% by weight or less in the wholesolid content of the resin composition, depending on the uses. If theamount of the binder resin exceeds 97% by weight, curability by lighttends to be decreased.

When the resin composition of the present invention is photo-cured, inorder to promote radical reaction, if required, other photoradicalgenerators may be used together with the compound (a). When otherphotoradical generators are used in combination, it is possible togenerate decomposition materials by other photoradical generators andcause problems in discoloration or physical properties of the curedfilm, volatilization of decomposition materials, stability andpreserving ability of the resin composition or the like. However, use ofthe compound (a) in combination can lessen the use amount of otherphotoradical generators, so that occurrence of the above-mentionedproblems is less possible than that in the case of using only otherphotoradical generators and even if such problems occur, the problemsare less serious and therefore, sufficient radical reactivity isexhibited and simultaneously the problems by the photoradical generatorscan be suppressed to an extent allowable for practical use.

Examples of other photoradical generators to be used include benzoin andits alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethylether, benzoin isopropyl ether or the like; acetophenones such asacetophenone, 2,2-dimethoxy-2-phenylacetophenone,2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone,1-hydroxyacetophenone, 1-hydroxycyclohexyl phenyl ketone,2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one or the like;anthraquinones such as 2-methylanthraquinione, 2-ethylanthraquinione,2-tert-butylanthraquinione, 1-chloroanthraquinione, 2-amylanthraquinioneor the like; thioxanthones such as 2,4-dimethylthioxanthone,2,4-diethylthioxanthone, 2-chlorothioxanthone,2,4-diisopropylthioxanthone or the like; ketals such as acetophenonedimethyl ketal, benzyl dimethyl ketal or the like; monoacylphosphineoxides or bisacylphosphine oxides such as 2,4,6-trimethylbenzolydiphenylphopshine oxide or the like; benzophenones such as benzophenoneor the like; and xanthones.

These photoradical generators may be used alone or in combination withbenzoic acid type or amine type photopolymerization initiating andpromoters. The mixing ratio of these photoradical generators ispreferably 0.1% by weight or more to 35% by weight or less, morepreferably 1% by weight or more to 10% by weight or less in the wholesolid contents of the resin composition.

To provide processability and other various functions to the resincomposition of the present invention, various organic and inorganic, lowor macro molecular compounds may be added. For example, dyes,surfactants, leveling agents, plasticizers, microparticles, sensitizersand the like can be employed. The microparticles may include organicmicroparticles such as polystyrene, polytetrafluoroethylene or the likeand inorganic microparticles of colloidal silica, carbon, laminarsilicates or the like and the functions and forms of them includepigments, fillers, fibers or the like.

The mixing ratio of these optional components is preferably in a rangeof 0.1 to 95% by weight in the whole solid contents of the resincomposition. If it is less than 0.1% by weight, the effects of the addedadditives are insufficient and if it exceeds 95% by weight, theproperties of the resin composition are not well reflected in the finalproduct.

When a large quantity of a component which absorbs radiated light isadded, light cannot reach sufficiently to the compound (a), which is aphotoradical generator, to result in decrease of the sensitivity.Therefore, from the viewpoint of importance of the sensitivity of theresin composition, the transmittance of the components other than thecompound (a) is preferably 20% or more in the wavelength range where theemitting wavelength of the light source and absorption wavelength of thecompound (a) added to the resin composition are overlapped.

The resin composition of the present invention may be diluted by using asolvent to a proper concentration. As the solvent, a variety of commonlyused solvents may be used and examples are ethers such as diethyl ether,tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethyleneglycol diethyl ether, propylene glycol dimethyl ether, propylene glycoldiethyl ether or the like; glycol monoethers (so-called cellosolves)such as ethylene glycol monomethyl ether, ethylene glycol monoethylether, propylene glycol monomethyl ether, propylene glycol monoethylether, diethylene glycol monomethyl ether, diethylene glycol monoethylether or the like; ketones such as methyl ethyl ketone, acetone, methylisobutyl ketone, cyclopentanone, cyclohexanone or the like; esters suchas ethyl acetate, butyl acetate, n-propyl acetate, iso-propyl acetate,n-butyl acetate, iso-butyl acetate, acetic acid esters of theabove-mentioned glycol monoethers (e.g. methyl cellosolve acetate andethyl cellosolve acetate), methoxypropyl acetate, ethoxypropyl acetate,dimethyl oxalate, methyl lactate, ethyl lactate or the like; alcoholssuch as ethanol, propanol, butanol, hexanol, cyclohexanol, ethyleneglycol, diethylene glycol, glycerin or the like; halo hydrocarbons suchas methylene chloride, 1,1-dichloroethane, 1,2-dichloroethylene,1-chloropropane, 1-chlorobutane, 1-chloropetane, chlorobenzene,bromobenzene, o-dichlorobenzene, m-dichlorobenzene or the like; amidessuch as N,N-dimethylformamide, N,N-dimethylacetamide or the like;pyrrolidones such as N-methylpyrrolidone or the like; lactones such asγ-butyrolactone or the like; sulfoxides such as dimethyl sulfoxide orthe like; and other organic polar solvents as well as aromatichydrocarbons such as benzene, toluene, xylene or the like and otherorganic non-polar solvents or the like. Further, as a reactive diluent,compounds having reactive groups such as ethylenic unsaturated compoundsin liquid state at a normal temperature may also be used as solvents.These solvents may be used alone or in combination. These solvents maybe used after being filtered by known various methods with, for example,a filter having a pore diameter of 0.05 μm to 0.2 μm to removeimpurities.

The resin composition can be produced by mixing the photoradicalgenerator, which is an essential component with, if required, a curablereactive compound such as the compound (b) having an ethylenicunsaturated group or the like, optional components such as highmolecular weight binder components and the like by stirring the mixtureor the like depending on the occasions and uses.

The resin composition of the present invention obtained in such a mannercan be used for all of the known fields and products, for whichmaterials curable or changeable in solubility by light radiation areutilized, such as pattern-forming materials (resist), coating materials,paints, printing inks, adhesives, fillers, electronic materials, moldingmaterials, three-dimensional articles or the like. Particularly, it issuitable for those which are required heat resistance and a highreliability, such as forming paints, printing inks, color filters,electronic parts, layer insulation films, wire cover films, opticalmembers, optical circuits, optical circuit parts, antireflection films,holograms or building materials.

In the case of, for example, the color filter, a pixel portion,light-shading portion (black matrix) disposed at a boundary of pixels, aprotective layer and a spacer for keeping a cell gap may be formed of acured product of the above described photosensitive resin composition.

In the case of the electronic parts, an under-filling agent, a sealingagent or the like used in semiconductor devices may be exemplified.

As to the layer insulation films, layer insulation films for build-upsubstrates, layer insulation films in fuel cells and insulation coatingsof car parts or domestic electric products, for which the heatresistance and the reliability to insulation are required, may be formedof a cured product of the photosensitive resin composition.

Also, as the wire protective films, solder resists which are wireprotective layers on the surface of printed boards, wire surface coversor the like may be exemplified.

In the case of the optical members, overcoats of various optical lenses,antireflection films, optical waveguides, optical circuit parts such aswave dividers or the like, relief type or volume type holograms or thelike may be exemplified.

In the case of the building materials, wall papers, wall materials,floor materials and other surface covering materials reduced in volatilecomponents, adhesives/pressure sensitive adhesives and inks may beexemplified.

The print product, color filter, electronic parts, layer insulationfilm, wire cover film, optical member, optical circuit, optical circuitparts, antireflection film, hologram or building material according tothe present invention has high heat resistance and stability andtherefore has such a merit that productive yield is high since at leasta part of each is formed of a cured product of the photosensitive resincomposition having high heat resistance and stability.

EXAMPLE Example 1

500 ml eggplant type flask was loaded with 5 g of LUNA 750 (productname: manufactured by Nihon Siber Hegner K. K.), which is a mixtureobtained by modifying benzophenone portion of α-aminoacetophenone with aplurality of caprolactone molecules, 12.5 g of 4-dimethylaminopyridine(DMAP) and 300 ml of dried toluene, and the mixture was stirred. 3 ml ofacrylic acid chloride was dropwise added to the mixture and stirred at aroom temperature for 1 hour. After that, 1 ml of acrylic acid chloridewas dropwise added after every 1 hour until no spot of the raw materialswas found in the resulting reaction solution by thin layerchromatography. On completion of the reaction, after the reactionsolution was treated with distilled water and a saturated sodiumhydrogencarbonate aqueous solution by a separating funnel, the organicsolvent layer was dehydrated by magnesium sulfate and the solvent wasremoved by distillation with a rotary evaporator. The obtained reactionsolution was refined by column chromatography to obtain a compound 1represented by the following formula (5). The compound 1 has a structurein which hexamer caprolactone-modified portion having acryloyl groupintroduced at the end is extended from the benzoyl group side of theradical generation portion:

Example 2

A mixture containing a raw material compound (A) represented by thefollowing formula (6) as a main component and a compound having the samebasic skeleton and differing in the number of the repeating units of thecaprolactone-modified portion was used in place of LUNA 750 in Example 1and reacted with acrylic acid chloride, and the obtained reactionproduct was refined in the same manner as Example 1 to obtain a compound2 represented by the following formula (7) The compound 2 has astructure formed by introducing an acryloyl group into the end of trimercaprolactone-modified portion of the compound (A):

Example 3

A mixture containing a raw material compound (B) represented by thefollowing formula (8) as a main component and a compound having the samebasic skeleton and differing in the number of the repeating units of thecaprolactone-modified portion was used in place of LUNA 750 in Example1, and reacted with acrylic acid chloride and the obtained reactionproduct was refined in the same manner as Example 1 to obtain a compound3 represented by the following formula (9). The compound 3 has astructure formed by introducing an acryloyl group into the end of trimercaprolactone-modified portion of the compound (B):

Example 4

A mixture containing a raw material compound (C) represented by thefollowing formula (10) as a main component and a compound having thesame basic skeleton and differing in the number of the repeating unitsof the caprolactone-modified portion was used in place of LUNA 750 inExample 1 and reacted with acrylic acid chloride, and the obtainedreaction product was refined in the same manner as Example 1 to obtain acompound 4 represented by the following formula (11). The compound 4 hasa structure formed by introducing an acryloyl group into the end oftrimer caprolactone-modified portion of the compound (C):

2. Evaluation Test(1) Evaluation of Heat Resistance

Using a differential type differential thermal balance (product name:TG8120; manufactured by Rigaku Corporation), the 5% reduction in weighttemperature of the compound 1 was measured at a temperature rise rate of10° C./min in nitrogen atmosphere. As comparative examples, samemeasurement was carried out for LUNA 750 (trade name; manufactured byNihon Siber Hegner K. K.) and Irgacure 907 (trade name; manufactured byCiba Specialty Chem. Corp.). Both of LUNA 750 and Irgacure 907 areself-cleavage type photoradical initiators. Particularly, LUNA 750 isthe raw material of the compound 1 and has a structure in which thecaprolactone-modified portion is extended from the benzoyl group side ofthe radical generation part.

The 5% reduction in weight temperatures of the compound 1 and therespective comparative compounds are shown in Table 1. As compared withLUNA 750 and Irg907 having photopolymerization initiating parts with thesame skeleton, it was found that the compound 1 considerably improvedthe 5% reduction in weight temperature owing to the introduction ofacryloyl group. According to this result, it was found that the heatresistance was improved and the production of volatile components byheating could be considerably decreased by introducing an acryloyl groupinto the self-cleavage type photoradical generator.

TABLE 1 5% reduction in weight temperature (° C.) Compound 1 330 LUNA750 192 Irg907 207(2) Curability Evaluation

Trifunctional pentaerythritol triacrylate (PETA) (product name; M305,manufactured by Toagosei Co., Ltd.) as a polyfunctional monomer wasmixed with the compounds 1 to 4, LUNA 750 (product name; manufactured byNihon Siber Hegner K. K.), and Irgacure 907 (product name; manufacturedby Ciba Specialty Chem. Corp.) at a ratio proper to adjust the moleratio of the photoradical generator portions of each example to thedouble bonds of the poly functional monomer to be 1/50, thus, THFsolutions of the respective mixtures were produced. Each solution wasspin-coated on a glass substrate, which was treated by chromiumsputtering, to form a coating layer. A coating layer containing only thetrifunctional acrylate and no initiator component was formed as a blank.

While each coating layer was exposed by UV, a decrement of the peak at810 cm⁻¹ was recorded with time by using an infrared spectrometer(product name: FTS6000; manufactured by BIO RAD) to confirm how much thedouble bond elimination was promoted. The atmosphere surrounding eachsample was replaced with nitrogen at the time of measurement. As the UVexposure apparatus, UV Spot Cure SP-III type (standard reflecting mirrortype) manufactured by Ushio Inc. was used and as the UV lamp, USH-255BY(manufactured by Ushio Inc.) was used.

The results of observing compatibility of each sample with trifunctionalacrylate M305, odor at the time of exposure, the decrease amount(reaction ratio) of the double bonds to the exposure, and coloring ofeach coating layer are shown in Table 2.

TABLE 2 Odor Reaction ratio (%) Compatibility during Exposure [mJ]Coloring in with M305 exposure 50 100 400 coating layer Com- ◯ No 51.856.8 64.5 Brown pound 1 2 ◯ No 33.1 41.1 47.6 Yellow 3 ◯ No 10.3 19.932.1 Pale yellow 4 ◯ No 12.1 22.2 36.3 Pale yellow LUNA ◯ No 55.1 60.769.7 Brown 750 Irg907 ◯ Yes 34.8 40.8 50.6 Yellow

According to the results, although being decreased slightly byintroduction of an acryloyl group as compared with that of LUNA 750, thereaction ratio of the compound 1 was improved as compared with that ofIrgacure 907 and thus found having good sensitivity. The higher reactionratio of the compound than that of Irgacure 907 having similar radicalgenerating parts was supposedly because of flexible skeleton of thecaprolactone portion which is a side chain introduced into the skeletonof the compound 1 and LUNA 750 so that the fluidity of the coating layerwas increased and the mobility of the radicals and reactive groups wasimproved

Although the compounds 1 and 2 had high degree in coloring of coatinglayers, they had high sensitivity and therefore they are suitable forthe cases which high sensitivity is required and the compounds 3 and 4had slight coloring in coating layers although having relatively lowsensitivity, and therefore they are supposed to be suitable for usesrequired to be highly transparent.

(3) Outgas Test

The compound 1 and pentaerythritol triacrylate (PETA) (trade name: M305,Toagosei Co., Ltd.) were mixed at a ratio adjusted so as to keep themole ratio of the double bonds of the compound 1 and the double bonds ofPETA at 1/50 (=compound 1/PETA) and diluted with chloroform so as toadjust the solids in an amount of 20 wt % (photosensitive resincomposition 1)

Photosensitive resin compositions 2 to 4 were also prepared in the samemanner by using the compounds 2 to 4 in place of the compound 1.

Each of the above-mentioned photosensitive resin compositions 1 to 4 wasspin-coated on a glass substrate and heated at 50° C. for 1 minute on ahot plate and exposed at 2,000 mJ/cm² based on the conversion into h rayby a high pressure mercury lamp using a manual exposure apparatus(MA-1200; manufactured by Dainippon Screen Co., Ltd.) to form a coatinglayer having thickness of 25 μm.

A photosensitive resin composition was prepared using Irgagure 907 and acoating layer was obtained in the same manner as a comparative example.

Each glass substrate coated with the coating layer was cut into 1 cm×1.5cm size and the gas emitted when heated at 250° C. for 1 hour wasanalyzed by GC-MS (QP-5000; manufactured by Shimadzu Corporation). Othermeasurement conditions were as follows:

Collection apparatus: Curie Point Purge and Trap (JHS-100A model;manufactured by Nippon Bunseki Kogyo Co., Ltd.);

Heating condition: 250° C.×60 min;

Adsorbent: TENAX TA (2,6-diphenyl-p-phenylene oxide) weak polarity;

Collection temperature: −40° C. (using liquefied nitrogen for cooling);

Thermal decomposition temperature: 255° C.×30 s;

Injection temperature: 250° C.;

Column: 5% phenyl-95% dimethyl siloxane (PTE-5) slight polarity, innerdiameter: 0.25 μm, length: 30 m;

Column temperature: 50° C.×5 min (holding), 10° C./min (temperatureincrease), 320° C.×3 min (holding);

Ionization method: electron bombardment ionization (EI method); and

Detector: quadruple detector.

According to the result of the outgas test, decomposition materialsderived from the polyfunctional monomer M-305 were detected for all ofthe samples using the compounds 1 to 4 and Irgacure 907.

As the outgas component derived from the initiator from the coatinglayer formed by using the compound 1, a slight amount of a compoundhaving morpholine skeleton was detected, however no compound havingaromatic ring was detected. On the other hand, as the outgas componentderived from the initiator from the coating layer formed by usingIrgacure 907, in addition to a slight amount of the compound havingmorpholine skeleton, compounds having aromatic rings such asbenzaldehyde and acetophenone were detected.

For the case of using the compounds 3 and 4, no aromatic compound wasdetected as the outgas component. For the case of using the compound 2,although aromatic compounds were detected, benzaldehyde and acetophenonewere not detected.

According to the above-mentioned facts, the compounds of the presentinvention were found effective to suppress particularly componentscontaining aromatic ring, which become causes of odor, in outgas derivedfrom initiators.

1. A photosensitive resin composition comprising at least a photoradicalgenerator selected from a group consisting of compounds (a) representedby the formula (1′):

wherein R¹ represents a hydrogen atom or a methyl group; each of R² andR³ represents a hydrogen atom; each of X1 and X3 represents a divalentgroup; and Y represents a monovalent group having an aliphatic tertiaryamine structure.
 2. A photosensitive resin composition according toclaim 1, further comprising at least a component selected from a groupconsisting of a compound (b) having an ethylenic unsaturated group, acurable reactive compound other than the compound (b), a radicalgenerator other than the compound (a) and a binder resin having a weightaverage molecular weight of 3,000 or more.
 3. A photosensitive resincomposition according to claim 1, being used as a pattern-formingmaterial.
 4. A photosensitive resin composition according to claim 1,being used as a paint, a printing ink, or a formation material of acolor filter, electronic parts, a layer insulation film, a wire coverfilm, an optical material, an optical circuit, optical circuit parts, anantireflection film, a hologram or a building material.
 5. A productselected from the group consisting of a printed product, a color filter,electronic parts, a layer insulation film, a wire cover film, an opticalmaterial, an optical circuit, optical circuit parts, an antireflectionfilm, a hologram and a building material, wherein at least a part of theproduct is formed of a cured product of the photosensitive resincomposition according to claim
 1. 6. The photosensitive resincomposition according to claim 1, wherein X contains S (sulfur) bondedto the benzoyl structure in the formula (1′).
 7. The photosensitiveresin composition according to claim 1, wherein the compounds (a) arecompounds represented by the formula (3):

wherein R¹ represents a hydrogen atom or a methyl group; each of R² andR³ represents a hydrogen atom; each of X1 and X3′ represents a divalentgroup, each of R⁴ and R⁵ independently represents a hydrogen atom or analkyl group having 1 to 15 carbon atoms; each of R⁶ and R⁷ independentlyrepresents a monovalent organic group which may contain a heteroatomother than a carbon atom; and R⁶ and R⁷ may be bonded to each other toform a ring structure.
 8. The photosensitive resin composition accordingto claim 1, wherein the aliphatic tertiary amine structure of Y in thecompounds (a) has a morpholine skeleton.
 9. The photosensitive resincomposition according to claim 1, wherein the compounds (a) arecompounds represented by the formula (1a):

wherein R¹ represents a hydrogen atom or a methyl group; each of R² andR³ represents a hydrogen atom; X3 represents a divalent group having asulfur or nitrogen atom bonded to the benzoyl structure; Y represents amonovalent group having an aliphatic tertiary amine structure; and nrepresents an integer of 3 to
 15. 10. A photosensitive resin compositioncomprising at least a photoradical generator selected from the groupconsisting of compounds (a″) represented by the formula (1″):

wherein R¹ represents a hydrogen atom or a methyl group; each of R² andR³ represents a hydrogen atom; each of X1 and X3 represents a divalentgroup; and X3 contains an oxygen atom bonded to the benzoyl structure.11. A product selected from the group consisting of a printed product, acolor filter, electronic parts, a layer insulation film, a wire coverfilm, an optical material, an optical circuit, optical circuit parts, anantireflection film, a hologram and a building material, wherein atleast a part of the product is formed of a cured product of thephotosensitive resin composition according to claim
 10. 12. Thephotosensitive resin composition according to claim 10, furthercomprising at least a component selected from the group consisting of acompound (b) having an ethylenic unsaturated group, a curable reactivecompound other than the compound (b), a radical generator other than thecompounds (a″) and a binder resin having a weight average molecularweight of 3,000 or more.
 13. The photosensitive resin compositionaccording to claim 10, wherein the compounds (a″) are compoundsrepresented by the formula (1b):

wherein R¹ represents a hydrogen atom or a methyl group; each of R² andR³ represents a hydrogen atom; X3 represents a divalent group having anoxygen atom bonded to the benzoyl structure; and n is an integer of 3 to15.